Verified Stores, Best Deals

MECHANIC XG-Z40 Solder Paste Flux 10ml Syringe for PCB, Phones, BGA Repair

MECHANIC XG-Z40 Solder Paste Flux 10ml Syringe for PCB, Phones, BGA Repair
MECHANIC XG-Z40 Solder Paste Flux 10ml Syringe for PCB, Phones, BGA Repair
MECHANIC XG-Z40 Solder Paste Flux 10ml Syringe for PCB, Phones, BGA Repair
MECHANIC XG-Z40 Solder Paste Flux 10ml Syringe for PCB, Phones, BGA Repair
MECHANIC XG-Z40 Solder Paste Flux 10ml Syringe for PCB, Phones, BGA Repair
MECHANIC XG-Z40 Solder Paste Flux 10ml Syringe for PCB, Phones, BGA Repair MECHANIC XG-Z40 Solder Paste Flux 10ml Syringe for PCB, Phones, BGA Repair MECHANIC XG-Z40 Solder Paste Flux 10ml Syringe for PCB, Phones, BGA Repair MECHANIC XG-Z40 Solder Paste Flux 10ml Syringe for PCB, Phones, BGA Repair MECHANIC XG-Z40 Solder Paste Flux 10ml Syringe for PCB, Phones, BGA Repair
7 - 25 SAR
Product In one shop
(0)

MECHANIC XG-Z40 High Performance Soldering Paste 10ml with Precision Needle for Mobile Phones & PCB Boards

Elevate your electronics repair experience with the MECHANIC XG-Z40 High Synthetic BGA Solder Flux Paste, designed to meet the demanding needs of professionals and enthusiasts in mobile phone and PCB circuit board repairs. This premium solder paste from the renowned MECHANIC brand is engineered for precise applications on BGA, SMD, and PGA components, delivering unmatched performance and reliable results.

Technical

Specifications

  • Brand: MECHANIC
  • Model: XG-Z40
  • Origin: China
  • Volume: 10ml
  • Material: High-quality alloyed tin powder & solder paste
  • Color: As shown in product images
  • Dimensions: Approx. 3.3 × 3.2 × 2.9 cm (1.30 × 1.30 × 1.14 inches)
  • Particle Size: 25–45 microns
  • Flux Type: No-Clean (does not require cleaning after use)
  • Includes precision needle for easy and accurate application

Features

  • Advanced synthetic formula ensures optimal viscosity and precise distribution for fine soldering points
  • Leaves no pale yellow residue, making board cleanup effortless after repairs
  • Suitable for all kinds of delicate electronics work including mobile phones, computers, and SMD/BGA repairs
  • User-friendly design with included needle for full control over paste placement
  • No need for post-solder cleaning, saving technicians valuable time and effort
  • Protects electronic components from damage caused by excessive heat during soldering

Use Cases

  • Repair and maintenance of mobile phone mainboards
  • Re-soldering or reballing of computer chips and intricate components
  • Perfect for electronics workshops, repair labs, professionals, and home users
  • Supports BGA reballing and complex circuit connectivity tasks

Benefits

  • Enhances soldering quality and reduces risks associated with poor electrical connections
  • Easy removal from boards without annoying residues
  • Extends the lifespan and usability of electronic components through added protection during repairs
  • Saves time with its convenient “no-clean” feature after soldering is complete

Care &

Usage Instructions

  • Store the paste in a cool, dry place away from direct sunlight
  • Ensure the cap is tightly closed after each use to maintain product quality
  • Apply only on clean, dry surfaces for best results
  • It is recommended to wear gloves during application to avoid direct skin contact

Whether you’re a repair professional or a hobbyist aiming for flawless results, MECHANIC XG-Z40 Soldering Paste is your ideal solution to upgrade your work quality in environments such as repair shops, electronics labs, and technical offices. Order now and achieve professional, effortless soldering results every time!

  • المنشأ: الصين
  • Origin: China
  • العلامة التجارية: MECHANIC
  • الموديل: XG-Z40
  • الحجم: 10 مل
  • المادة: خليط من مسحوق القصدير عالي الجودة ومعجون اللحام
  • اللون: كما هو موضح بالصورة
  • الأبعاد: 3.3 × 3.2 × 2.9 سم تقريباً
  • حجم الجزيئات: 25-45 ميكرون
  • نوع التدفق: لا يحتاج تنظيف (No-Clean)
  • الاستخدامات: إصلاح وصيانة لوحات الهواتف المحمولة ولوحات الدوائر الإلكترونية (PCB)، إعادة لحام وتركيب شرائح الكمبيوتر والمكونات الدقيقة، إعادة تكوير كرات اللحام (BGA reballing)
  • ملحقات: يأتي مع إبرة للتطبيق الدقيق
  • Brand: MECHANIC
  • Model: XG-Z40
  • Volume: 10ml
  • Material: High-quality tin powder and solder paste mixture
  • Color: As shown in the picture
  • Dimensions: Approx. 3.3 × 3.2 × 2.9 cm
  • Particle Size: 25-45 microns
  • Flux Type: No-Clean
  • Applications: Repair and maintenance of mobile phone PCBs, re-soldering and reinstallation of computer chips and fine components, BGA reballing
  • Accessories: Includes needle for precise application
Please fill the fields below:
Disclaimer: Labeb.com has gathered the above information either from the store contact directly or from the information published on the store's website. In some cases, the store policies and conditions may change without being fully reflected in the above information. We urge you to check the store's policies on the store website directly, using the links provided above, or to contact the store directly in case you have any questions. The inforamtion is presented for reference only. Labeb.com is not held accountable in case store's policies were different than stated above or have changed, or in case the store did not abide with his stated policies. Please always follow up with the store directly.
Choose Specifications 2 options
Storage:
Showing 2 price from 1 store
Important information
📍 No nearby stores available for this product